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The increasing computing power of AI servers creates significant thermal challenges. Traditional air cooling solutions are becoming insufficient for high-density GPU systems.We provide advanced AI liquid cooling cold plate solutions designed to improve heat transfer efficiency and maintain stable operation of next-generation computing equipment.
E-MAIL:info@hms1688.com



Liquid cold plates are critical thermal components in AI servers and high-performance computing systems.By circulating coolant through precision-designed channels, cold plates directly remove heat from high-power chips and improve overall system efficiency.



Our manufacturing capability supports complex thermal structures including internal channels, copper heat transfer plates and aluminum cooling assemblies.Precision machining helps achieve accurate channel dimensions, surface flatness and reliable sealing performance.


Different applications require different thermal materials.Copper provides excellent thermal conductivity for high-performance cooling, while aluminum offers lightweight advantages and efficient heat dissipation.
We strictly protect customer drawings and technical data.NDA support is available for confidential AI cooling projects.
E-MAIL:info@hms1688.com